Modeling of epoxy dispensing process using a hybrid fuzzy regression approach
In the semiconductor manufacturing industry, epoxy dispensing is a popular process commonly used in die bonding as well as in microchip encapsulation for electronic packaging. Modeling the epoxy dispensing process is important because it enables us to understand the process behavior, as well as dete...
| Main Authors: | , |
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| Format: | Journal Article |
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Springer London
2012
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| Online Access: | http://hdl.handle.net/20.500.11937/8392 |