Electric current-restrained crack propagation in brittle GaN ceramics
© 2021, The Author(s), under exclusive licence to Springer Science+Business Media, LLC part of Springer Nature. The reliability of a ceramic structure or device is closely related to its faults, such as structural defects and cracks. Here, we show that cracking in piezoelectric semi-conductive ceram...
| Main Authors: | , , , |
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| Format: | Journal Article |
| Language: | English |
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SPRINGER
2021
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| Subjects: | |
| Online Access: | http://hdl.handle.net/20.500.11937/82381 |
| _version_ | 1848764497359011840 |
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| author | Zhao, M.H. Umair, M. Lu, Chunsheng Qin, G.S. |
| author_facet | Zhao, M.H. Umair, M. Lu, Chunsheng Qin, G.S. |
| author_sort | Zhao, M.H. |
| building | Curtin Institutional Repository |
| collection | Online Access |
| description | © 2021, The Author(s), under exclusive licence to Springer Science+Business Media, LLC part of Springer Nature. The reliability of a ceramic structure or device is closely related to its faults, such as structural defects and cracks. Here, we show that cracking in piezoelectric semi-conductive ceramics (PSCs) can be restrained with the application of an electric current. Due to the crack-generated flexoelectricity, piezoelectric polarization charges that generate and gather on the front of a crack result in a strong thermoelectric effect. The phase transition and plastic deformation happened near a crack tip can hinder the propagation of the crack and even lead to its partial closure. These new findings are instructive to study the crack control and the design of PSC devices with damage tolerance. |
| first_indexed | 2025-11-14T11:20:18Z |
| format | Journal Article |
| id | curtin-20.500.11937-82381 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T11:20:18Z |
| publishDate | 2021 |
| publisher | SPRINGER |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-823812021-06-28T02:19:25Z Electric current-restrained crack propagation in brittle GaN ceramics Zhao, M.H. Umair, M. Lu, Chunsheng Qin, G.S. Science & Technology Technology Materials Science, Multidisciplinary Materials Science FRACTURE-TOUGHNESS CONDUCTIVE CRACKS FIELD BEHAVIOR FAILURE © 2021, The Author(s), under exclusive licence to Springer Science+Business Media, LLC part of Springer Nature. The reliability of a ceramic structure or device is closely related to its faults, such as structural defects and cracks. Here, we show that cracking in piezoelectric semi-conductive ceramics (PSCs) can be restrained with the application of an electric current. Due to the crack-generated flexoelectricity, piezoelectric polarization charges that generate and gather on the front of a crack result in a strong thermoelectric effect. The phase transition and plastic deformation happened near a crack tip can hinder the propagation of the crack and even lead to its partial closure. These new findings are instructive to study the crack control and the design of PSC devices with damage tolerance. 2021 Journal Article http://hdl.handle.net/20.500.11937/82381 10.1007/s10853-020-05692-2 English SPRINGER restricted |
| spellingShingle | Science & Technology Technology Materials Science, Multidisciplinary Materials Science FRACTURE-TOUGHNESS CONDUCTIVE CRACKS FIELD BEHAVIOR FAILURE Zhao, M.H. Umair, M. Lu, Chunsheng Qin, G.S. Electric current-restrained crack propagation in brittle GaN ceramics |
| title | Electric current-restrained crack propagation in brittle GaN ceramics |
| title_full | Electric current-restrained crack propagation in brittle GaN ceramics |
| title_fullStr | Electric current-restrained crack propagation in brittle GaN ceramics |
| title_full_unstemmed | Electric current-restrained crack propagation in brittle GaN ceramics |
| title_short | Electric current-restrained crack propagation in brittle GaN ceramics |
| title_sort | electric current-restrained crack propagation in brittle gan ceramics |
| topic | Science & Technology Technology Materials Science, Multidisciplinary Materials Science FRACTURE-TOUGHNESS CONDUCTIVE CRACKS FIELD BEHAVIOR FAILURE |
| url | http://hdl.handle.net/20.500.11937/82381 |