Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging

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Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging

© 2019 Elsevier B.V. This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in...

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Bibliographic Details
Main Authors:	Quadir, Zakaria, Singh, G., Rickard, William, Haseeb, A.S.M.A.
Format:	Journal Article
Language:	English
Published:	ELSEVIER 2020
Subjects:	Science & Technology Technology Physical Sciences Materials Science, Multidisciplinary Physics, Applied Materials Science Physics FAB bonding EBSD TKD Laser treatment Gold Copper COLD DIFFRACTION MICROBANDS
Online Access:	http://hdl.handle.net/20.500.11937/82057

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