Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging

Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging

© 2019 Elsevier B.V. This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in...

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Bibliographic Details
Main Authors: Quadir, Zakaria, Singh, G., Rickard, William, Haseeb, A.S.M.A.
Format: Journal Article
Language:English
Published: ELSEVIER 2020
Subjects:
Science & Technology
Technology
Physical Sciences
Materials Science, Multidisciplinary
Physics, Applied
Materials Science
Physics
FAB bonding
EBSD
TKD
Laser treatment
Gold
Copper
COLD
DIFFRACTION
MICROBANDS
Online Access:http://hdl.handle.net/20.500.11937/82057

Internet

http://hdl.handle.net/20.500.11937/82057

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