Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging
© 2019 Elsevier B.V. This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in...
| Main Authors: | , , , |
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| Format: | Journal Article |
| Language: | English |
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ELSEVIER
2020
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| Subjects: | |
| Online Access: | http://hdl.handle.net/20.500.11937/82057 |
| _version_ | 1848764467252297728 |
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| author | Quadir, Zakaria Singh, G. Rickard, William Haseeb, A.S.M.A. |
| author_facet | Quadir, Zakaria Singh, G. Rickard, William Haseeb, A.S.M.A. |
| author_sort | Quadir, Zakaria |
| building | Curtin Institutional Repository |
| collection | Online Access |
| description | © 2019 Elsevier B.V. This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves simultaneous application of laser heat and ultrasonic pressure. The beneficial effects of laser heating are apparent to overcoming the processing challenges associated with high hardness of copper. The application of laser yields columnar gains and grain size gradient. The laser-assisted samples have undergone a different deformation mechanism which is indicated by the non-localized nature of deformation. The dynamic thermal restorations in the laser-assisted sample are obvious. |
| first_indexed | 2025-11-14T11:19:49Z |
| format | Journal Article |
| id | curtin-20.500.11937-82057 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| language | English |
| last_indexed | 2025-11-14T11:19:49Z |
| publishDate | 2020 |
| publisher | ELSEVIER |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-820572021-03-09T01:02:44Z Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging Quadir, Zakaria Singh, G. Rickard, William Haseeb, A.S.M.A. Science & Technology Technology Physical Sciences Materials Science, Multidisciplinary Physics, Applied Materials Science Physics FAB bonding EBSD TKD Laser treatment Gold Copper COLD DIFFRACTION MICROBANDS © 2019 Elsevier B.V. This paper studies the crystallographic and substructural details in copper wire bonds on integrated circuit chips. Copper is regarded a potential replacement of gold wire bonding technology used in electronic device manufacturing. The innovative manufacturing process adopted in this work involves simultaneous application of laser heat and ultrasonic pressure. The beneficial effects of laser heating are apparent to overcoming the processing challenges associated with high hardness of copper. The application of laser yields columnar gains and grain size gradient. The laser-assisted samples have undergone a different deformation mechanism which is indicated by the non-localized nature of deformation. The dynamic thermal restorations in the laser-assisted sample are obvious. 2020 Journal Article http://hdl.handle.net/20.500.11937/82057 10.1016/j.matlet.2019.126833 English ELSEVIER restricted |
| spellingShingle | Science & Technology Technology Physical Sciences Materials Science, Multidisciplinary Physics, Applied Materials Science Physics FAB bonding EBSD TKD Laser treatment Gold Copper COLD DIFFRACTION MICROBANDS Quadir, Zakaria Singh, G. Rickard, William Haseeb, A.S.M.A. Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging |
| title | Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging |
| title_full | Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging |
| title_fullStr | Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging |
| title_full_unstemmed | Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging |
| title_short | Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging |
| title_sort | substructural phenomena in cu wire bond after laser assisted manufacturing in electronic packaging |
| topic | Science & Technology Technology Physical Sciences Materials Science, Multidisciplinary Physics, Applied Materials Science Physics FAB bonding EBSD TKD Laser treatment Gold Copper COLD DIFFRACTION MICROBANDS |
| url | http://hdl.handle.net/20.500.11937/82057 |