APA (7th ed.) Citation

Quadir, Z., Singh, G., Rickard, W., & Haseeb, A. (2020). Substructural phenomena in Cu wire bond after laser assisted manufacturing in electronic packaging. ELSEVIER.

Chicago Style (17th ed.) Citation

Quadir, Zakaria, G. Singh, William Rickard, and A.S.M.A Haseeb. Substructural Phenomena in Cu Wire Bond After Laser Assisted Manufacturing in Electronic Packaging. ELSEVIER, 2020.

MLA (9th ed.) Citation

Quadir, Zakaria, et al. Substructural Phenomena in Cu Wire Bond After Laser Assisted Manufacturing in Electronic Packaging. ELSEVIER, 2020.