Stress control of porous silicon film for microelectromechanical systems

Control of stress in porous silicon (PS) through porosity changes was studied using X-ray diffraction rocking curve measurements. The effect of thermal annealing on the stress was also investigated, which showed the ability to achieve compressive or tensile films in a reversible manner. The effect o...

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Main Authors: Sun, Xiao, Keating, Adrian, Parish, Giacinta
Other Authors: Faraone, L
Format: Conference Paper
Language:English
Published: IEEE 2014
Subjects:
Online Access:http://hdl.handle.net/20.500.11937/80013
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author Sun, Xiao
Keating, Adrian
Parish, Giacinta
author2 Faraone, L
author_facet Faraone, L
Sun, Xiao
Keating, Adrian
Parish, Giacinta
author_sort Sun, Xiao
building Curtin Institutional Repository
collection Online Access
description Control of stress in porous silicon (PS) through porosity changes was studied using X-ray diffraction rocking curve measurements. The effect of thermal annealing on the stress was also investigated, which showed the ability to achieve compressive or tensile films in a reversible manner. The effect of stress on the resonant frequency of PS microbeams was studied to understand the impact of PS film stress when used as the structural layer in a microelectromechanical systems sensor. The results indicated that stress is a significant factor in determining resonant frequency, shifting it by up to a factor of 3.6 from the zero stress state, illustrating the need for accurate control.
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spelling curtin-20.500.11937-800132021-01-04T05:32:50Z Stress control of porous silicon film for microelectromechanical systems Sun, Xiao Keating, Adrian Parish, Giacinta Faraone, L Martyniuk, M Science & Technology Technology Physical Sciences Engineering, Electrical & Electronic Nanoscience & Nanotechnology Optics Engineering Science & Technology - Other Topics Porous silicon stress X-ray diffraction annealing resonant frequency X-RAY-DIFFRACTION Control of stress in porous silicon (PS) through porosity changes was studied using X-ray diffraction rocking curve measurements. The effect of thermal annealing on the stress was also investigated, which showed the ability to achieve compressive or tensile films in a reversible manner. The effect of stress on the resonant frequency of PS microbeams was studied to understand the impact of PS film stress when used as the structural layer in a microelectromechanical systems sensor. The results indicated that stress is a significant factor in determining resonant frequency, shifting it by up to a factor of 3.6 from the zero stress state, illustrating the need for accurate control. 2014 Conference Paper http://hdl.handle.net/20.500.11937/80013 10.1109/COMMAD.2014.7038693 English IEEE restricted
spellingShingle Science & Technology
Technology
Physical Sciences
Engineering, Electrical & Electronic
Nanoscience & Nanotechnology
Optics
Engineering
Science & Technology - Other Topics
Porous silicon
stress
X-ray diffraction
annealing
resonant frequency
X-RAY-DIFFRACTION
Sun, Xiao
Keating, Adrian
Parish, Giacinta
Stress control of porous silicon film for microelectromechanical systems
title Stress control of porous silicon film for microelectromechanical systems
title_full Stress control of porous silicon film for microelectromechanical systems
title_fullStr Stress control of porous silicon film for microelectromechanical systems
title_full_unstemmed Stress control of porous silicon film for microelectromechanical systems
title_short Stress control of porous silicon film for microelectromechanical systems
title_sort stress control of porous silicon film for microelectromechanical systems
topic Science & Technology
Technology
Physical Sciences
Engineering, Electrical & Electronic
Nanoscience & Nanotechnology
Optics
Engineering
Science & Technology - Other Topics
Porous silicon
stress
X-ray diffraction
annealing
resonant frequency
X-RAY-DIFFRACTION
url http://hdl.handle.net/20.500.11937/80013