Released micromachined beams utilizing laterally uniform porosity porous silicon

© 2014, Sun et al.; licensee Springer. Abstract: Suspended micromachined porous silicon beams with laterally uniform porosity are reported, which have been fabricated using standard photolithography processes designed for compatibility with complementary metal-oxide-semiconductor (CMOS) processe...

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Main Authors: Sun, Xiao, Keating, Adrian, Parish, Giacinta
Format: Journal Article
Published: Springer New York 2014
Online Access:http://hdl.handle.net/20.500.11937/79814
_version_ 1848764108961218560
author Sun, Xiao
Keating, Adrian
Parish, Giacinta
author_facet Sun, Xiao
Keating, Adrian
Parish, Giacinta
author_sort Sun, Xiao
building Curtin Institutional Repository
collection Online Access
description © 2014, Sun et al.; licensee Springer. Abstract: Suspended micromachined porous silicon beams with laterally uniform porosity are reported, which have been fabricated using standard photolithography processes designed for compatibility with complementary metal-oxide-semiconductor (CMOS) processes. Anodization, annealing, reactive ion etching, repeated photolithography, lift off and electropolishing processes were used to release patterned porous silicon microbeams on a Si substrate. This is the first time that micromachined, suspended PS microbeams have been demonstrated with laterally uniform porosity, well-defined anchors and flat surfaces. PACS: 81.16.-c; 81.16.Nd; 81.16.Rf
first_indexed 2025-11-14T11:14:07Z
format Journal Article
id curtin-20.500.11937-79814
institution Curtin University Malaysia
institution_category Local University
last_indexed 2025-11-14T11:14:07Z
publishDate 2014
publisher Springer New York
recordtype eprints
repository_type Digital Repository
spelling curtin-20.500.11937-798142021-01-08T07:54:28Z Released micromachined beams utilizing laterally uniform porosity porous silicon Sun, Xiao Keating, Adrian Parish, Giacinta © 2014, Sun et al.; licensee Springer. Abstract: Suspended micromachined porous silicon beams with laterally uniform porosity are reported, which have been fabricated using standard photolithography processes designed for compatibility with complementary metal-oxide-semiconductor (CMOS) processes. Anodization, annealing, reactive ion etching, repeated photolithography, lift off and electropolishing processes were used to release patterned porous silicon microbeams on a Si substrate. This is the first time that micromachined, suspended PS microbeams have been demonstrated with laterally uniform porosity, well-defined anchors and flat surfaces. PACS: 81.16.-c; 81.16.Nd; 81.16.Rf 2014 Journal Article http://hdl.handle.net/20.500.11937/79814 10.1186/1556-276X-9-426 http://creativecommons.org/licenses/by/4.0/ Springer New York fulltext
spellingShingle Sun, Xiao
Keating, Adrian
Parish, Giacinta
Released micromachined beams utilizing laterally uniform porosity porous silicon
title Released micromachined beams utilizing laterally uniform porosity porous silicon
title_full Released micromachined beams utilizing laterally uniform porosity porous silicon
title_fullStr Released micromachined beams utilizing laterally uniform porosity porous silicon
title_full_unstemmed Released micromachined beams utilizing laterally uniform porosity porous silicon
title_short Released micromachined beams utilizing laterally uniform porosity porous silicon
title_sort released micromachined beams utilizing laterally uniform porosity porous silicon
url http://hdl.handle.net/20.500.11937/79814