Stress control of porous silicon films for microelectromechanical systems
© 2015 Elsevier Inc. All rights reserved. Control of stress in porous silicon (PS) through porosity changes was studied using X-ray diffraction rocking curve measurements. The effect of thermal annealing on the stress was also investigated with both X-ray diffraction and radius of curvature meas...
| Main Authors: | , , |
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| Format: | Journal Article |
| Published: |
Elsevier
2015
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| Online Access: | http://hdl.handle.net/20.500.11937/79813 |