Material Selection for Interfacial Bond Layer in Electronic Packaging

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Material Selection for Interfacial Bond Layer in Electronic Packaging

In electronic packaging, typically two or more thin dissimilar plates or layers are bonded together by an extremely thin adhesive bond layer. Electronic assemblies are usually operated under high power conditions which predictably produces a high temperature environment in the electronic devices. Th...

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Bibliographic Details
Main Authors:	Debnath, Sujan, Vincent, L., Pok, Y.
Format:	Conference Paper
Published:	2018
Online Access:	http://hdl.handle.net/20.500.11937/71193

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