Material Selection for Interfacial Bond Layer in Electronic Packaging
In electronic packaging, typically two or more thin dissimilar plates or layers are bonded together by an extremely thin adhesive bond layer. Electronic assemblies are usually operated under high power conditions which predictably produces a high temperature environment in the electronic devices. Th...
| Main Authors: | , , |
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| Format: | Conference Paper |
| Published: |
2018
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| Online Access: | http://hdl.handle.net/20.500.11937/71193 |