APA (7th ed.) Citation

Debnath, S., Vincent, L., & Pok, Y. (2018). Material Selection for Interfacial Bond Layer in Electronic Packaging.

Chicago Style (17th ed.) Citation

Debnath, Sujan, L. Vincent, and Y. Pok. Material Selection for Interfacial Bond Layer in Electronic Packaging. 2018.

MLA (9th ed.) Citation

Debnath, Sujan, et al. Material Selection for Interfacial Bond Layer in Electronic Packaging. 2018.