Development of Pb-Free Nanocomposite Solder Alloys

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Development of Pb-Free Nanocomposite Solder Alloys

As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC) based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs) during aging/reflow. Accordingly, this study examines the improvement...

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Bibliographic Details
Main Authors:	Basak, A., Pramanik, Alokesh, Riazi, H., Silakhori, M., Netting, A.
Format:	Journal Article
Published:	MDPI AG 2018
Online Access:	http://hdl.handle.net/20.500.11937/69586

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