Development of Pb-Free Nanocomposite Solder Alloys
As an alternative to conventional Pb-containing solder material, Sn–Ag–Cu (SAC) based alloys are at the forefront despite limitations associated with relatively poor strength and coarsening of grains/intermetallic compounds (IMCs) during aging/reflow. Accordingly, this study examines the improvement...
| Main Authors: | , , , , |
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| Format: | Journal Article |
| Published: |
MDPI AG
2018
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| Online Access: | http://hdl.handle.net/20.500.11937/69586 |