Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging

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Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging

© The Authors, published by EDP Sciences, 2017. The flip chip bonding technology is widely used in electronic packaging as a result of improvements towards mechanical performance of layered structures. However, thermal mismatch shear and peeling stress are often induced by the differences of the mat...

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Bibliographic Details
Main Authors:	Pok, Y., Debnath, Sujan, Rahman, Muhammad, Dol, S.
Format:	Conference Paper
Published:	2017
Online Access:	http://hdl.handle.net/20.500.11937/58657

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