Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging
© The Authors, published by EDP Sciences, 2017. The flip chip bonding technology is widely used in electronic packaging as a result of improvements towards mechanical performance of layered structures. However, thermal mismatch shear and peeling stress are often induced by the differences of the mat...
| Main Authors: | , , , |
|---|---|
| Format: | Conference Paper |
| Published: |
2017
|
| Online Access: | http://hdl.handle.net/20.500.11937/58657 |