APA (7th ed.) Citation

Pok, Y., Debnath, S., Rahman, M., & Dol, S. (2017). Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging.

Chicago Style (17th ed.) Citation

Pok, Y., Sujan Debnath, Muhammad Rahman, and S. Dol. Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging. 2017.

MLA (9th ed.) Citation

Pok, Y., et al. Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging. 2017.