Leaching of tin from waste Pb-free solder in hydrochloric acid solution with stannic chloride

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Leaching of tin from waste Pb-free solder in hydrochloric acid solution with stannic chloride

A hydrochloric acid (HCl) leaching process with stannic chloride (SnCl4) was proposed to leach Sn from waste Pb-free solder containing Sn, Ag, and Cu, where the oxidant stannic ion (Sn4 +) oxidizes Sn metal into stannous ion (Sn2 +). When Sn reagent-grade powder was leached in HCl solution with SnCl...

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Bibliographic Details
Main Authors:	Kim, S., Lee, J., Yoo, Kyoungkeun
Format:	Journal Article
Published:	Elsevier 2016
Online Access:	http://hdl.handle.net/20.500.11937/54873

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