Leaching of tin from waste Pb-free solder in hydrochloric acid solution with stannic chloride
A hydrochloric acid (HCl) leaching process with stannic chloride (SnCl4) was proposed to leach Sn from waste Pb-free solder containing Sn, Ag, and Cu, where the oxidant stannic ion (Sn4 +) oxidizes Sn metal into stannous ion (Sn2 +). When Sn reagent-grade powder was leached in HCl solution with SnCl...
| Main Authors: | , , |
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| Format: | Journal Article |
| Published: |
Elsevier
2016
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| Online Access: | http://hdl.handle.net/20.500.11937/54873 |