Dismantling of Electric and Electronic Components from Waste Printed Circuit Boards by Hydrochloric Acid Leaching with Stannic Ions

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Dismantling of Electric and Electronic Components from Waste Printed Circuit Boards by Hydrochloric Acid Leaching with Stannic Ions

A dismantling process for separating electric and electronic components (EECs) from printed circuit board (PCB) was developed by using hydrochloric acid (HCl) leaching with stannic ions (Sn⁴⁺). The use of HCl solution with Sn⁴⁺ ions dissolves tin (Sn)-alloy solder that holds EECs on bare board, whic...

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Bibliographic Details
Main Authors:	Jung, M., Yoo, Kyoungkeun, Alorro, Richard
Format:	Journal Article
Published:	Japan Institute of Metals and Materials 2017
Online Access:	http://hdl.handle.net/20.500.11937/54733

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