Dismantling of Electric and Electronic Components from Waste Printed Circuit Boards by Hydrochloric Acid Leaching with Stannic Ions
A dismantling process for separating electric and electronic components (EECs) from printed circuit board (PCB) was developed by using hydrochloric acid (HCl) leaching with stannic ions (Sn⁴⁺). The use of HCl solution with Sn⁴⁺ ions dissolves tin (Sn)-alloy solder that holds EECs on bare board, whic...
| Main Authors: | , , |
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| Format: | Journal Article |
| Published: |
Japan Institute of Metals and Materials
2017
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| Online Access: | http://hdl.handle.net/20.500.11937/54733 |