Separation of Cu, Sn, Pb from copper scrap coated with Sn and Pb

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Separation of Cu, Sn, Pb from copper scrap coated with Sn and Pb

Tin/lead plating technologies have been used for unsurpassed solderability and in electrical and electronic equipments eliminating the potential for tin whisker formation. The present study is aimed at recovering of Cu, Sn, Pb, respectively, from the copper scrap coated with Pb and Sn. In the recycl...

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Bibliographic Details
Main Authors:	Yoo, Kyoungkeun, Moon, G.
Format:	Conference Paper
Published:	2015
Online Access:	http://hdl.handle.net/20.500.11937/53885

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