Separation of Cu, Sn, Pb from copper scrap coated with Sn and Pb
Tin/lead plating technologies have been used for unsurpassed solderability and in electrical and electronic equipments eliminating the potential for tin whisker formation. The present study is aimed at recovering of Cu, Sn, Pb, respectively, from the copper scrap coated with Pb and Sn. In the recycl...
| Main Authors: | , |
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| Format: | Conference Paper |
| Published: |
2015
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| Online Access: | http://hdl.handle.net/20.500.11937/53885 |