Performance study of solder bond on thermal mismatch stresses in electronic packaging assembly

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Performance study of solder bond on thermal mismatch stresses in electronic packaging assembly

Thermo-mechanical stresses have been considered as one of the major concern in electronic Packaging assembly structural failure. The interfacial stresses are often caused by the thermal mismatch stresses induced by the coefficient of thermal expansion (CTE) difference between materials, typically du...

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Bibliographic Details
Main Authors:	Debnath, Sujan, Pang, X., Rahman, Ekhlasur, Moola, Mohan Reddy
Other Authors:	Prof. A Kiet Tieu
Format:	Conference Paper
Published:	AMPT2012 2012
Online Access:	http://hdl.handle.net/20.500.11937/46330

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