Performance study of solder bond on thermal mismatch stresses in electronic packaging assembly
Thermo-mechanical stresses have been considered as one of the major concern in electronic Packaging assembly structural failure. The interfacial stresses are often caused by the thermal mismatch stresses induced by the coefficient of thermal expansion (CTE) difference between materials, typically du...
| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Conference Paper |
| Published: |
AMPT2012
2012
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| Online Access: | http://hdl.handle.net/20.500.11937/46330 |