APA (7th ed.) Citation

Debnath, S., Pang, X., Rahman, E., Moola, M. R., & Tieu, P. A. K. (2012). Performance study of solder bond on thermal mismatch stresses in electronic packaging assembly. AMPT2012.

Chicago Style (17th ed.) Citation

Debnath, Sujan, X. Pang, Ekhlasur Rahman, Mohan Reddy Moola, and Prof. A Kiet Tieu. Performance Study of Solder Bond on Thermal Mismatch Stresses in Electronic Packaging Assembly. AMPT2012, 2012.

MLA (9th ed.) Citation

Debnath, Sujan, et al. Performance Study of Solder Bond on Thermal Mismatch Stresses in Electronic Packaging Assembly. AMPT2012, 2012.