Skip to content
VuFind
Advanced
  • Characterisation of the interf...
  • Cite this
  • Print
  • Export Record
    • Export to RefWorks
    • Export to EndNoteWeb
    • Export to EndNote
Characterisation of the interface adhesion of elastic-plastic thin film/rigid substrate systems using a pressurized blister test numerical model
QR Code

Characterisation of the interface adhesion of elastic-plastic thin film/rigid substrate systems using a pressurized blister test numerical model

Bibliographic Details
Main Authors: Jiang, L., Zhou, Y., Hao, H., Liao, Y., Lu, Chungsheng
Format: Journal Article
Published: Elsevier Ltd 2010
Online Access:http://hdl.handle.net/20.500.11937/45166
  • Holdings
  • Description
  • Similar Items
  • Staff View

Internet

http://hdl.handle.net/20.500.11937/45166

Similar Items

  • Determination of interfacial adhesive properties for polymeric film by blister test
    by: Wang, Z., et al.
    Published: (2013)
  • Mathematical Analysis on the Uniqueness of Reverse Algorithm for Measuring Elastic-plastic Properties by Sharp Indentation
    by: Huang, Y., et al.
    Published: (2011)
  • An inverse approach for extracting elastic-plastic properties of thin films from small scale sharp indentation
    by: Ma, Z., et al.
    Published: (2012)
  • Nanoscale elastic-plastic deformation and stress distributions on the C plane of sapphire single crystal during nanoindentation
    by: Mao, W., et al.
    Published: (2011)
  • Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method
    by: Wang, Z., et al.
    Published: (2013)

Search Options

  • Advanced Search

Find More

  • Browse the Catalog

Need Help?

  • Search Tips