Debnath, S., Pang, X., Rahman, M., & Moola, M. (2014). Performance of Solder Bond on Thermal Mismatch Stresses in Electronic Packaging Assembly. Trans Tech Publications.
Chicago Style (17th ed.) CitationDebnath, Sujan, X. Pang, Muhammad Rahman, and Mohan Moola. Performance of Solder Bond on Thermal Mismatch Stresses in Electronic Packaging Assembly. Trans Tech Publications, 2014.
MLA (9th ed.) CitationDebnath, Sujan, et al. Performance of Solder Bond on Thermal Mismatch Stresses in Electronic Packaging Assembly. Trans Tech Publications, 2014.
Warning: These citations may not always be 100% accurate.