Performance of Solder Bond on Thermal Mismatch Stresses in Electronic Packaging Assembly
Thermo-mechanical stresses have been considered one of the major concerns in electronic Packaging assembly structural failure. The interfacial stresses are often caused by the thermal mismatch stresses induced by the coefficient of thermal expansion (CTE) difference between materials, typically duri...
| Main Authors: | , , , |
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| Format: | Journal Article |
| Published: |
Trans Tech Publications
2014
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| Online Access: | http://hdl.handle.net/20.500.11937/36966 |