Heat transfer and fluid flow characteristics of microchannels with internal longitudinal fins
Electronic components generate large amount of heat during their operation, which requires to be dissipated. Over the past decade, internal heat generation levels have exponentially increased due to the compact packaging of high-powered microelectronic circuitry in modern devices. The efficient remo...
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| Format: | Thesis |
| Language: | English |
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Curtin University
2009
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| Online Access: | http://hdl.handle.net/20.500.11937/360 |