Separation of Tin, Silver and Copper from Waste Pb-free Solder Using Hydrochloric Acid Leaching with Hydrogen Peroxide

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Separation of Tin, Silver and Copper from Waste Pb-free Solder Using Hydrochloric Acid Leaching with Hydrogen Peroxide

The waste lead (Pb)-free solder leaching process in hydrochloric acid (HCl) solution with hydrogen peroxide (H2O2) followed by separation of copper (Cu) and tin (Sn) was investigated to separate tin, silver (Ag), and copper as an individual component from waste Pb-free solder. The dissolution of Sn...

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Bibliographic Details
Main Authors:	Kim, S., Lee, J., Lee, K., Yoo, K., Alorro, Richard
Format:	Journal Article
Published:	Japan Institute of Metals and Materials 2014
Subjects:	hydrochloric acid leaching recycling cementation process lead-free solder
Online Access:	http://hdl.handle.net/20.500.11937/31796

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