Separation of Tin, Silver and Copper from Waste Pb-free Solder Using Hydrochloric Acid Leaching with Hydrogen Peroxide
The waste lead (Pb)-free solder leaching process in hydrochloric acid (HCl) solution with hydrogen peroxide (H2O2) followed by separation of copper (Cu) and tin (Sn) was investigated to separate tin, silver (Ag), and copper as an individual component from waste Pb-free solder. The dissolution of Sn...
| Main Authors: | , , , , |
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| Format: | Journal Article |
| Published: |
Japan Institute of Metals and Materials
2014
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| Subjects: | |
| Online Access: | http://hdl.handle.net/20.500.11937/31796 |