Electronic Packaging Model with Continuous and Discontinuous Bond Layer

Electronic Packaging Model with Continuous and Discontinuous Bond Layer

Interfacial stress due to thermal mismatch in layered structure has been considered as one of the major causes of mechanical failure in electronic packaging. The mismatch of the coefficient thermal expansion (CTE) of the materials in multiplayer structure may induce serious stress concentrations to...

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Bibliographic Details
Main Authors: Ting, K.P., Sujan, Debnath
Other Authors: F. E. Tang
Format: Conference Paper
Published: School of Engineering & Science, Curtin University Sarawak Campus 2012
Subjects:
Bond layer
Bi-layered assembly
Thermal mismatch
Flip Chip Ball Grid Array
Interfacial shear stress
Online Access:http://hdl.handle.net/20.500.11937/31369

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