Electronic Packaging Model with Continuous and Discontinuous Bond Layer
Interfacial stress due to thermal mismatch in layered structure has been considered as one of the major causes of mechanical failure in electronic packaging. The mismatch of the coefficient thermal expansion (CTE) of the materials in multiplayer structure may induce serious stress concentrations to...
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| Format: | Conference Paper |
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School of Engineering & Science, Curtin University Sarawak Campus
2012
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| Online Access: | http://hdl.handle.net/20.500.11937/31369 |