APA (7th ed.) Citation

Ting, K., Sujan, D., & Tang, F. E. (2012). Electronic Packaging Model with Continuous and Discontinuous Bond Layer. School of Engineering & Science, Curtin University Sarawak Campus.

Chicago Style (17th ed.) Citation

Ting, K.P, Debnath Sujan, and F. E. Tang. Electronic Packaging Model with Continuous and Discontinuous Bond Layer. School of Engineering & Science, Curtin University Sarawak Campus, 2012.

MLA (9th ed.) Citation

Ting, K.P, et al. Electronic Packaging Model with Continuous and Discontinuous Bond Layer. School of Engineering & Science, Curtin University Sarawak Campus, 2012.