Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change

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Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change

Bibliographic Details
Main Authors:	Debnath, Sujan, Woldemichael, Dereje, Murthy, M., Seetharamu, K.
Format:	Journal Article
Published:	ASME 2011
Online Access:	http://hdl.handle.net/20.500.11937/29416

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