Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change

Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change

Bibliographic Details
Main Authors: Debnath, Sujan, Woldemichael, Dereje, Murthy, M., Seetharamu, K.
Format: Journal Article
Published: ASME 2011
Online Access:http://hdl.handle.net/20.500.11937/29416

Internet

http://hdl.handle.net/20.500.11937/29416

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