Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change
| Main Authors: | , , , |
|---|---|
| Format: | Journal Article |
| Published: |
ASME
2011
|
| Online Access: | http://hdl.handle.net/20.500.11937/29416 |
| _version_ | 1848752797033431040 |
|---|---|
| author | Debnath, Sujan Woldemichael, Dereje Murthy, M. Seetharamu, K. |
| author_facet | Debnath, Sujan Woldemichael, Dereje Murthy, M. Seetharamu, K. |
| author_sort | Debnath, Sujan |
| building | Curtin Institutional Repository |
| collection | Online Access |
| first_indexed | 2025-11-14T08:14:19Z |
| format | Journal Article |
| id | curtin-20.500.11937-29416 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-14T08:14:19Z |
| publishDate | 2011 |
| publisher | ASME |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-294162017-09-13T15:26:24Z Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change Debnath, Sujan Woldemichael, Dereje Murthy, M. Seetharamu, K. 2011 Journal Article http://hdl.handle.net/20.500.11937/29416 10.1115/1.4005294 ASME restricted |
| spellingShingle | Debnath, Sujan Woldemichael, Dereje Murthy, M. Seetharamu, K. Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change |
| title | Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change |
| title_full | Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change |
| title_fullStr | Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change |
| title_full_unstemmed | Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change |
| title_short | Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change |
| title_sort | effect of bond layer on bi-material assembly subjected to uniform temperature change |
| url | http://hdl.handle.net/20.500.11937/29416 |