APA (7th ed.) Citation

Debnath, S., Woldemichael, D., Murthy, M., & Seetharamu, K. (2011). Effect of bond layer on Bi-Material Assembly subjected to Uniform Temperature Change. ASME.

Chicago Style (17th ed.) Citation

Debnath, Sujan, Dereje Woldemichael, M. Murthy, and K. Seetharamu. Effect of Bond Layer on Bi-Material Assembly Subjected to Uniform Temperature Change. ASME, 2011.

MLA (9th ed.) Citation

Debnath, Sujan, et al. Effect of Bond Layer on Bi-Material Assembly Subjected to Uniform Temperature Change. ASME, 2011.