Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching
A recycling process consisting of swelling, ammonia leaching and hydrochloric acid leaching was developed to recover Sn, Bi, Cu, and resin from Pb-free Sn-Bi-Cu solder paste. The resin was separated from metal powder by swelling the solder paste in methyl ethyl ketone at 30 °C, 200 rpm and 5% pulp d...
| Main Authors: | , , |
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| Format: | Journal Article |
| Published: |
Elsevier
2017
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| Online Access: | http://hdl.handle.net/20.500.11937/27814 |
| _version_ | 1848752367443378176 |
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| author | Jeon, S. Yoo, K. Alorro, Richard |
| author_facet | Jeon, S. Yoo, K. Alorro, Richard |
| author_sort | Jeon, S. |
| building | Curtin Institutional Repository |
| collection | Online Access |
| description | A recycling process consisting of swelling, ammonia leaching and hydrochloric acid leaching was developed to recover Sn, Bi, Cu, and resin from Pb-free Sn-Bi-Cu solder paste. The resin was separated from metal powder by swelling the solder paste in methyl ethyl ketone at 30 °C, 200 rpm and 5% pulp density. The addition of distilled water precipitated the resin from methyl ethyl ketone. The recovered resin was confirmed to be epoxy resin by FT-IR analysis. Ammonia leaching followed by hydrochloric acid leaching was performed to separate Cu, Sn, Bi sequentially from metal powder. Copper was solubilized easily with leaching efficiency reaching 100% within 15 min under the following conditions: 5 M NH3 solution, 1 M (NH4)2CO3, 0.1 M CuCO3, 50 °C, and 1% pulp density. Tin and bismuth were recovered as leach residue in the ammonia leaching. Tin was selectively leached in 0.5 M HCl solution with 10,000 mg/L Sn4 + and 1% pulp density at 50 °C and 400 rpm, while Bi was not detected in the leach solution. The recycling process has successfully separated Sn, Cu, Bi and resin. |
| first_indexed | 2025-11-14T08:07:30Z |
| format | Journal Article |
| id | curtin-20.500.11937-27814 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-14T08:07:30Z |
| publishDate | 2017 |
| publisher | Elsevier |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-278142017-09-13T15:11:56Z Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching Jeon, S. Yoo, K. Alorro, Richard A recycling process consisting of swelling, ammonia leaching and hydrochloric acid leaching was developed to recover Sn, Bi, Cu, and resin from Pb-free Sn-Bi-Cu solder paste. The resin was separated from metal powder by swelling the solder paste in methyl ethyl ketone at 30 °C, 200 rpm and 5% pulp density. The addition of distilled water precipitated the resin from methyl ethyl ketone. The recovered resin was confirmed to be epoxy resin by FT-IR analysis. Ammonia leaching followed by hydrochloric acid leaching was performed to separate Cu, Sn, Bi sequentially from metal powder. Copper was solubilized easily with leaching efficiency reaching 100% within 15 min under the following conditions: 5 M NH3 solution, 1 M (NH4)2CO3, 0.1 M CuCO3, 50 °C, and 1% pulp density. Tin and bismuth were recovered as leach residue in the ammonia leaching. Tin was selectively leached in 0.5 M HCl solution with 10,000 mg/L Sn4 + and 1% pulp density at 50 °C and 400 rpm, while Bi was not detected in the leach solution. The recycling process has successfully separated Sn, Cu, Bi and resin. 2017 Journal Article http://hdl.handle.net/20.500.11937/27814 10.1016/j.hydromet.2016.12.004 Elsevier restricted |
| spellingShingle | Jeon, S. Yoo, K. Alorro, Richard Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching |
| title | Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching |
| title_full | Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching |
| title_fullStr | Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching |
| title_full_unstemmed | Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching |
| title_short | Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching |
| title_sort | separation of sn, bi, cu from pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching |
| url | http://hdl.handle.net/20.500.11937/27814 |