Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching
A recycling process consisting of swelling, ammonia leaching and hydrochloric acid leaching was developed to recover Sn, Bi, Cu, and resin from Pb-free Sn-Bi-Cu solder paste. The resin was separated from metal powder by swelling the solder paste in methyl ethyl ketone at 30 °C, 200 rpm and 5% pulp d...
| Main Authors: | , , |
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| Format: | Journal Article |
| Published: |
Elsevier
2017
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| Online Access: | http://hdl.handle.net/20.500.11937/27814 |