APA (7th ed.) Citation

Jeon, S., Yoo, K., & Alorro, R. (2017). Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching. Elsevier.

Chicago Style (17th ed.) Citation

Jeon, S., K. Yoo, and Richard Alorro. Separation of Sn, Bi, Cu from Pb-free Solder Paste by Ammonia Leaching Followed by Hydrochloric Acid Leaching. Elsevier, 2017.

MLA (9th ed.) Citation

Jeon, S., et al. Separation of Sn, Bi, Cu from Pb-free Solder Paste by Ammonia Leaching Followed by Hydrochloric Acid Leaching. Elsevier, 2017.