Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers

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Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers

In this paper, we introduce a new bonding technology for the assembly of micro- structured glass substrates for miniaturized chemical analysis. The protocol features a facile polymer chemistry method processing at lower temperatures (<100 °C). The method consisted of a proper cleaning of the...

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Bibliographic Details
Main Authors:	Zhao, J., Jin, F., Liu, Shaomin
Format:	Journal Article
Published:	Springer 2014
Online Access:	http://hdl.handle.net/20.500.11937/26670

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