Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers

In this paper, we introduce a new bonding technology for the assembly of micro- structured glass substrates for miniaturized chemical analysis. The protocol features a facile polymer chemistry method processing at lower temperatures (<100 °C). The method consisted of a proper cleaning of the...

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Main Authors: Zhao, J., Jin, F., Liu, Shaomin
Format: Journal Article
Published: Springer 2014
Online Access:http://hdl.handle.net/20.500.11937/26670
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author Zhao, J.
Jin, F.
Zhao, J.
Liu, Shaomin
author_facet Zhao, J.
Jin, F.
Zhao, J.
Liu, Shaomin
author_sort Zhao, J.
building Curtin Institutional Repository
collection Online Access
description In this paper, we introduce a new bonding technology for the assembly of micro- structured glass substrates for miniaturized chemical analysis. The protocol features a facile polymer chemistry method processing at lower temperatures (<100 °C). The method consisted of a proper cleaning of the two glass surfaces, followed by hydroxylization, aminosilylation and hyperbranched polyurethane oligomers (HPU) bridging on quartz wafer surfaces as the interlayer. Strong bonding with a shear force 4.5 MPa has been achieved. The present procedure avoids the possible micro-channel blockage and contamination by using conventional adhesives. Moreover, the microfluidic chips bonded by the above procedures are highly transparent therefore allowing for biochemical compositions to be easily characterized by UV–vis or IR spectroscopy.
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institution Curtin University Malaysia
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publishDate 2014
publisher Springer
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spelling curtin-20.500.11937-266702017-11-24T07:04:37Z Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers Zhao, J. Jin, F. Zhao, J. Liu, Shaomin In this paper, we introduce a new bonding technology for the assembly of micro- structured glass substrates for miniaturized chemical analysis. The protocol features a facile polymer chemistry method processing at lower temperatures (<100 °C). The method consisted of a proper cleaning of the two glass surfaces, followed by hydroxylization, aminosilylation and hyperbranched polyurethane oligomers (HPU) bridging on quartz wafer surfaces as the interlayer. Strong bonding with a shear force 4.5 MPa has been achieved. The present procedure avoids the possible micro-channel blockage and contamination by using conventional adhesives. Moreover, the microfluidic chips bonded by the above procedures are highly transparent therefore allowing for biochemical compositions to be easily characterized by UV–vis or IR spectroscopy. 2014 Journal Article http://hdl.handle.net/20.500.11937/26670 10.1007/s00542-014-2258-9 Springer restricted
spellingShingle Zhao, J.
Jin, F.
Zhao, J.
Liu, Shaomin
Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers
title Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers
title_full Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers
title_fullStr Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers
title_full_unstemmed Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers
title_short Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers
title_sort low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers
url http://hdl.handle.net/20.500.11937/26670