Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly

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Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly

The thermal mismatch induced interfacial stresses are one of the major reliability issues in electronic packaging and composite materials. Consequently an understanding of the nature of the interfacial stresses under different temperature conditions is essential in order to eliminate or reduce the r...

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Bibliographic Details
Main Authors:	Debnath, Sujan, Oo, Zeya, Murthy, M.V.V., Seetharamu, K.N.
Format:	Journal Article
Published:	Science publications 2010
Subjects:	Shearing stress different uniform temperature peeling stress thickness wise linear temperature gradient
Online Access:	http://hdl.handle.net/20.500.11937/25717

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