Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly
The thermal mismatch induced interfacial stresses are one of the major reliability issues in electronic packaging and composite materials. Consequently an understanding of the nature of the interfacial stresses under different temperature conditions is essential in order to eliminate or reduce the r...
| Main Authors: | , , , |
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| Format: | Journal Article |
| Published: |
Science publications
2010
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| Subjects: | |
| Online Access: | http://hdl.handle.net/20.500.11937/25717 |