Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly
The thermal mismatch induced interfacial stresses are one of the major reliability issues in electronic packaging and composite materials. Consequently an understanding of the nature of the interfacial stresses under different temperature conditions is essential in order to eliminate or reduce the r...
| Main Authors: | , , , |
|---|---|
| Format: | Journal Article |
| Published: |
Science publications
2010
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/20.500.11937/25717 |
| _version_ | 1848751785336897536 |
|---|---|
| author | Debnath, Sujan Oo, Zeya Murthy, M.V.V. Seetharamu, K.N. |
| author_facet | Debnath, Sujan Oo, Zeya Murthy, M.V.V. Seetharamu, K.N. |
| author_sort | Debnath, Sujan |
| building | Curtin Institutional Repository |
| collection | Online Access |
| description | The thermal mismatch induced interfacial stresses are one of the major reliability issues in electronic packaging and composite materials. Consequently an understanding of the nature of the interfacial stresses under different temperature conditions is essential in order to eliminate or reduce the risk of structural and functional failure. Approach: In this analysis, a model was proposed for the shearing and peeling stresses occurring at the interface of two bonded dissimilar materials with the effect of different uniform temperatures in the layers. The model was then upgraded by accounting thickness wise linear temperature gradients in the layers using two temperature drop ratios. The upgraded models were then compared with the existing uniform temperature model. The proposed model can be seen as a more generalized form to predict interfacial stresses at different temperature conditions that may occur in the layers. Results: The results were presented for an electronic bi-material package consisting of die and die-attach. Conclusion: The numerical simulation is in a good matching agreement with analytical results. |
| first_indexed | 2025-11-14T07:58:15Z |
| format | Journal Article |
| id | curtin-20.500.11937-25717 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-14T07:58:15Z |
| publishDate | 2010 |
| publisher | Science publications |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-257172017-09-13T15:17:39Z Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly Debnath, Sujan Oo, Zeya Murthy, M.V.V. Seetharamu, K.N. Shearing stress different uniform temperature peeling stress thickness wise linear temperature gradient The thermal mismatch induced interfacial stresses are one of the major reliability issues in electronic packaging and composite materials. Consequently an understanding of the nature of the interfacial stresses under different temperature conditions is essential in order to eliminate or reduce the risk of structural and functional failure. Approach: In this analysis, a model was proposed for the shearing and peeling stresses occurring at the interface of two bonded dissimilar materials with the effect of different uniform temperatures in the layers. The model was then upgraded by accounting thickness wise linear temperature gradients in the layers using two temperature drop ratios. The upgraded models were then compared with the existing uniform temperature model. The proposed model can be seen as a more generalized form to predict interfacial stresses at different temperature conditions that may occur in the layers. Results: The results were presented for an electronic bi-material package consisting of die and die-attach. Conclusion: The numerical simulation is in a good matching agreement with analytical results. 2010 Journal Article http://hdl.handle.net/20.500.11937/25717 10.3844/ajassp.2010.829.834 Science publications fulltext |
| spellingShingle | Shearing stress different uniform temperature peeling stress thickness wise linear temperature gradient Debnath, Sujan Oo, Zeya Murthy, M.V.V. Seetharamu, K.N. Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly |
| title | Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly |
| title_full | Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly |
| title_fullStr | Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly |
| title_full_unstemmed | Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly |
| title_short | Effect of Different Uniform Temperature with Thickness-Wise Linear Temperature Gradient on Interfacial Stresses of a Bi-Material Assembly |
| title_sort | effect of different uniform temperature with thickness-wise linear temperature gradient on interfacial stresses of a bi-material assembly |
| topic | Shearing stress different uniform temperature peeling stress thickness wise linear temperature gradient |
| url | http://hdl.handle.net/20.500.11937/25717 |