Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method

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Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method

To characterize the mechanical properties of thin films, an improved blister method is proposed, which combines a digital speckle correlation method with the blister test. Based on this method, an experimental setup is developed to measure Young's modulus, residual stress, and interfacial adhes...

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Bibliographic Details
Main Authors:	Wang, Z., Ma, Z., Zhou, Y., Lu, Chunsheng
Format:	Journal Article
Published:	Elsevier B.V. 2013
Subjects:	residual stress young's modulus interfacial adhesion energy blister test digital speckle correlation method
Online Access:	http://hdl.handle.net/20.500.11937/20980

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