Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method
To characterize the mechanical properties of thin films, an improved blister method is proposed, which combines a digital speckle correlation method with the blister test. Based on this method, an experimental setup is developed to measure Young's modulus, residual stress, and interfacial adhes...
| Main Authors: | , , , |
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| Format: | Journal Article |
| Published: |
Elsevier B.V.
2013
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| Subjects: | |
| Online Access: | http://hdl.handle.net/20.500.11937/20980 |