Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method
To characterize the mechanical properties of thin films, an improved blister method is proposed, which combines a digital speckle correlation method with the blister test. Based on this method, an experimental setup is developed to measure Young's modulus, residual stress, and interfacial adhes...
| Main Authors: | , , , |
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| Format: | Journal Article |
| Published: |
Elsevier B.V.
2013
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| Subjects: | |
| Online Access: | http://hdl.handle.net/20.500.11937/20980 |
| _version_ | 1848750461350313984 |
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| author | Wang, Z. Ma, Z. Zhou, Y. Lu, Chunsheng |
| author_facet | Wang, Z. Ma, Z. Zhou, Y. Lu, Chunsheng |
| author_sort | Wang, Z. |
| building | Curtin Institutional Repository |
| collection | Online Access |
| description | To characterize the mechanical properties of thin films, an improved blister method is proposed, which combines a digital speckle correlation method with the blister test. Based on this method, an experimental setup is developed to measure Young's modulus, residual stress, and interfacial adhesion energy of an electroplated nickel film. The results show that the improved blister method has the advantage of a high accuracy full-field measurement with the simple operation and low requirement on environments, which can be used to characterize the mechanical properties of films with various scales from laboratorial to industrial applications. |
| first_indexed | 2025-11-14T07:37:12Z |
| format | Journal Article |
| id | curtin-20.500.11937-20980 |
| institution | Curtin University Malaysia |
| institution_category | Local University |
| last_indexed | 2025-11-14T07:37:12Z |
| publishDate | 2013 |
| publisher | Elsevier B.V. |
| recordtype | eprints |
| repository_type | Digital Repository |
| spelling | curtin-20.500.11937-209802017-09-13T13:45:15Z Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method Wang, Z. Ma, Z. Zhou, Y. Lu, Chunsheng residual stress young's modulus interfacial adhesion energy blister test digital speckle correlation method To characterize the mechanical properties of thin films, an improved blister method is proposed, which combines a digital speckle correlation method with the blister test. Based on this method, an experimental setup is developed to measure Young's modulus, residual stress, and interfacial adhesion energy of an electroplated nickel film. The results show that the improved blister method has the advantage of a high accuracy full-field measurement with the simple operation and low requirement on environments, which can be used to characterize the mechanical properties of films with various scales from laboratorial to industrial applications. 2013 Journal Article http://hdl.handle.net/20.500.11937/20980 10.1016/j.pnsc.2013.08.001 Elsevier B.V. unknown |
| spellingShingle | residual stress young's modulus interfacial adhesion energy blister test digital speckle correlation method Wang, Z. Ma, Z. Zhou, Y. Lu, Chunsheng Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method |
| title | Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method |
| title_full | Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method |
| title_fullStr | Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method |
| title_full_unstemmed | Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method |
| title_short | Measurement of the mechanical properties of nickel film based on the full-field deformation: An improved blister method |
| title_sort | measurement of the mechanical properties of nickel film based on the full-field deformation: an improved blister method |
| topic | residual stress young's modulus interfacial adhesion energy blister test digital speckle correlation method |
| url | http://hdl.handle.net/20.500.11937/20980 |